High Density Panel Display Series
High density panel display, in the form of integrated 3in1 encapsulation,
broke through the limitations of traditional LED display encapsulation methods and achieved higher pixel density.
It adopts SPC (Solid Phase Crystallization) under the condition of normal temperature,
aluminum wire ultrasonic welding and non-reflow soldering to avoid thermal damage effectively
Compression resistance, higher stability, good heat dissipation, wide viewing angle, energy efficient
This series is more stable than traditional SMD ones.
Since the LED lamp of high density panel display do not require the reflow soldering,
it largely avoided the damage ratio of the lamp holder and epoxy gap during the high temperature soldering,
The unique encapsulation method is very helpful to protect the LED lamp, and increase the resistance.
Ast Heat Dissipation
This kind of LED chip was encapsulated directly on the PCB board,
the heat can dissipate through the PCB board and aluminum plate over the cabinet.
It realizes the mode of heat dissipation from a point to a surface,
makes the heat dissipation more faster and heat conduction efficiency much higher.
It effectively weakens light attenuation of LED chip, and prolongs the life span of the LED display.
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